Intel X299 Ultra Durable motherboard with RGB Fusion, Digital LED strip support, Dual M.2, 120dB SNR ALC1220, Intel Gaming LAN, USB 3.1 gen 2 Type-A
- Supports Intel® Core™ X-Series Processor Family
- Quad Channel Non-ECC Unbuffered DDR4, 8 DIMMs
- Intel® Optane™ Memory Ready
- Intel® VROC ready
- ASMedia 3142 USB 3.1 Gen 2 with USB Type-A
- 3-Way Graphics Support
- Server-Class Digital Power Design
- ALC1220 120dB SNR HD Audio with Smart Headphone AMP and WIMA audio capacitor
- RGB FUSION support Digital LED and RGBW Light Strips
- Smart Fan 5 features Multiple Temperature Sensors and Hybrid Fan Headers with FAN STOP
- Dual Ultra-Fast M.2 with PCIe Gen3 x4 interface
- NVMe PCIe Gen3 x4 U.2 support by optional adaptor
- Intel GbE LAN Gaming Network with cFosSpeed Internet Accelerator Software
- Anti-Sulfur Resistor Design
- Ultra Durable™ 25KV ESD and 15KV Surge LAN Protection
- Lightning-Fast Intel® Thunderbolt™ 3 AIC Support
- GIGABYTE UEFI DualBIOS™
- APP Center Including EasyTune™ and Cloud Station™ Utilities
CPU:
Support for Intel® Core™ X series processors in the LGA2066 package
L3 cache varies with CPU
Chipset:
Intel® X299 Express Chipset
Memory:
8 x DDR4 DIMM sockets supporting up to 128 GB of system memory.
* Support for up to 512 GB of system memory when using Registered DIMMs.
* Supported when using a 44-lane or 28-lane CPU (6-core or above).
4 x DDR4 DIMM sockets supporting up to 64 GB of system memory.
* Supported when using a 16-lane CPU (4-core).
4 channel memory architecture.
* Supported when using a 44-lane or 28-lane CPU (6-core or above).
Dual channel memory architecture.
Supported when using a 16-lane CPU (4-core).
Support for DDR4 4400(O.C.) / 4333(O.C.) / 4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3666(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200(O.C.) / 3000(O.C.) / 2800(O.C.) / 2666(O.C.) / 2400 / 2133 MHz memory modules
Support for non-ECC Un-buffered DIMM memory modules
Support for Registered DIMM 1Rx8/2Rx8/1Rx4/2Rx4 memory modules (operate in non-ECC mode)
* R-DIMM is only supported by BIOS version F3 and earlier versions.
Support for Extreme Memory Profile (XMP) memory modules
Audio:
Realtek® ALC1220 codec
High Definition Audio
2/4/5.1/7.1-channel
Support for S/PDIF Out
LAN:
Intel® GbE LAN chip (10/100/1000 Mbit)
2 x PCI Express x16 slots, running at x16 (PCIEX16_1, PCIEX16_2)
1 x PCI Express x16 slot, running at x8 (PCIEX8)
2 x PCI Express x16 slots, running at x4 (PCIEX4_1, PCIEX4_2)
(All of the PCI Express slots conform to PCI Express 3.0 standard.)
* Refer to "1-6 Setting up AMD CrossFire™/NVIDIA® SLI™ Configuration," for the installation notices for the PCI Express x16 slots
Storage Interface
Chipset:
- 1 x M.2 connector (Socket 3, M key, type 2242/2260/2280 SATA and PCIe x4/x2 SSD support) (M2Q_32G)
- 1 x M.2 connector (Socket 3, M key, type 2260/2280/22110 SATA and PCIe x4/x2 SSD support) (M2P_32G)
8 x SATA 6Gb/s connectors
Support for RAID 0, RAID 1, RAID 5, and RAID 10
* Refer to "1-9 Internal Connectors," for the installation notices for the M.2 and SATA connectors.
Intel® Optane™ Memory Ready
Intel® VROC Ready
Multi-Graphics Technology:
Support for NVIDIA® Quad-GPU SLI™ and 3-Way (with 44-lane CPU) / 2-Way (with 44 & 28-lane CPU) NVIDIA® SLI™ technologies
Support for AMD Quad-GPU CrossFire™ and 3-Way (with 44-lane CPU) / 2-Way AMD CrossFire™ technologies
USB:
Chipset+ASMedia® USB 3.1 Gen 2 Controller:
2 x USB 3.1 Gen 2 Type-A ports (red) on the back panel
Chipset:
10 x USB 3.1 Gen 1 ports (6 ports on the back panel, 4 ports available through the internal USB headers)
4 x USB 2.0/1.1 ports available through the internal USB headers
Internal I/O Connectors:
1 x 24-pin ATX main power connector
1 x 8-pin ATX 12V power connector
1 x CPU fan header
1 x water cooling CPU fan header
2 x system fan headers
1 x 3 Amp fan/water cooling pump header
1 x digital LED strip header
1 x digital LED strip power select jumper
2 x RGB (RGBW) LED strip extension cable headers
2 x M.2 Socket 3 connectors
8 x SATA 6Gb/s connectors
1 x Intel® VROC Upgrade Key header
1 x front panel header
1 x front panel audio header
1 x S/PDIF Out header
2 x USB 3.1 Gen 1 headers
2 x USB 2.0/1.1 headers
1 x Thunderbolt™ add-in card connector
1 x Trusted Platform Module (TPM) header (2x6 pin, for the GC-TPM2.0_S module only)
1 x temperature sensor header
1 x Clear CMOS jumper
Back Panel Connectors:
1 x PS/2 keyboard/mouse port
2 x USB 3.1 Gen 2 Type-A ports (red)
6 x USB 3.1 Gen 1 ports
1 x RJ-45 port
6 x audio jacks (Center/Subwoofer Speaker Out, Rear Speaker Out, Side Speaker Out, Line In, Line Out, Mic In)
I/O Controller:
iTE® I/O Controller Chip
BIOS:
2 x 128 Mbit flash
Use of licensed AMI UEFI BIOS
Support for DualBIOS™
PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0
Form Factor:
ATX Form Factor; 30.5cm x 24.4cm
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- Supports Intel® Core™ X-Series Processor Family
- Quad Channel Non-ECC Unbuffered DDR4, 8 DIMMs
- Intel® Optane™ Memory Ready
- Intel® VROC ready
- ASMedia 3142 USB 3.1 Gen 2 with USB Type-A
- 3-Way Graphics Support
- Server-Class Digital Power Design
- ALC1220 120dB SNR HD Audio with Smart Headphone AMP and WIMA audio capacitor
- RGB FUSION support Digital LED and RGBW Light Strips
- Smart Fan 5 features Multiple Temperature Sensors and Hybrid Fan Headers with FAN STOP
- Dual Ultra-Fast M.2 with PCIe Gen3 x4 interface
- NVMe PCIe Gen3 x4 U.2 support by optional adaptor
- Intel GbE LAN Gaming Network with cFosSpeed Internet Accelerator Software
- Anti-Sulfur Resistor Design
- Ultra Durable™ 25KV ESD and 15KV Surge LAN Protection
- Lightning-Fast Intel® Thunderbolt™ 3 AIC Support
- GIGABYTE UEFI DualBIOS™
- APP Center Including EasyTune™ and Cloud Station™ Utilities
CPU:
Support for Intel® Core™ X series processors in the LGA2066 package
L3 cache varies with CPU
Chipset:
Intel® X299 Express Chipset
Memory:
8 x DDR4 DIMM sockets supporting up to 128 GB of system memory.
* Support for up to 512 GB of system memory when using Registered DIMMs.
* Supported when using a 44-lane or 28-lane CPU (6-core or above).
4 x DDR4 DIMM sockets supporting up to 64 GB of system memory.
* Supported when using a 16-lane CPU (4-core).
4 channel memory architecture.
* Supported when using a 44-lane or 28-lane CPU (6-core or above).
Dual channel memory architecture.
Supported when using a 16-lane CPU (4-core).
Support for DDR4 4400(O.C.) / 4333(O.C.) / 4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3666(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200(O.C.) / 3000(O.C.) / 2800(O.C.) / 2666(O.C.) / 2400 / 2133 MHz memory modules
Support for non-ECC Un-buffered DIMM memory modules
Support for Registered DIMM 1Rx8/2Rx8/1Rx4/2Rx4 memory modules (operate in non-ECC mode)
* R-DIMM is only supported by BIOS version F3 and earlier versions.
Support for Extreme Memory Profile (XMP) memory modules
Audio:
Realtek® ALC1220 codec
High Definition Audio
2/4/5.1/7.1-channel
Support for S/PDIF Out
LAN:
Intel® GbE LAN chip (10/100/1000 Mbit)
2 x PCI Express x16 slots, running at x16 (PCIEX16_1, PCIEX16_2)
1 x PCI Express x16 slot, running at x8 (PCIEX8)
2 x PCI Express x16 slots, running at x4 (PCIEX4_1, PCIEX4_2)
(All of the PCI Express slots conform to PCI Express 3.0 standard.)
* Refer to "1-6 Setting up AMD CrossFire™/NVIDIA® SLI™ Configuration," for the installation notices for the PCI Express x16 slots
Storage Interface
Chipset:
- 1 x M.2 connector (Socket 3, M key, type 2242/2260/2280 SATA and PCIe x4/x2 SSD support) (M2Q_32G)
- 1 x M.2 connector (Socket 3, M key, type 2260/2280/22110 SATA and PCIe x4/x2 SSD support) (M2P_32G)
8 x SATA 6Gb/s connectors
Support for RAID 0, RAID 1, RAID 5, and RAID 10
* Refer to "1-9 Internal Connectors," for the installation notices for the M.2 and SATA connectors.
Intel® Optane™ Memory Ready
Intel® VROC Ready
Multi-Graphics Technology:
Support for NVIDIA® Quad-GPU SLI™ and 3-Way (with 44-lane CPU) / 2-Way (with 44 & 28-lane CPU) NVIDIA® SLI™ technologies
Support for AMD Quad-GPU CrossFire™ and 3-Way (with 44-lane CPU) / 2-Way AMD CrossFire™ technologies
USB:
Chipset+ASMedia® USB 3.1 Gen 2 Controller:
2 x USB 3.1 Gen 2 Type-A ports (red) on the back panel
Chipset:
10 x USB 3.1 Gen 1 ports (6 ports on the back panel, 4 ports available through the internal USB headers)
4 x USB 2.0/1.1 ports available through the internal USB headers
Internal I/O Connectors:
1 x 24-pin ATX main power connector
1 x 8-pin ATX 12V power connector
1 x CPU fan header
1 x water cooling CPU fan header
2 x system fan headers
1 x 3 Amp fan/water cooling pump header
1 x digital LED strip header
1 x digital LED strip power select jumper
2 x RGB (RGBW) LED strip extension cable headers
2 x M.2 Socket 3 connectors
8 x SATA 6Gb/s connectors
1 x Intel® VROC Upgrade Key header
1 x front panel header
1 x front panel audio header
1 x S/PDIF Out header
2 x USB 3.1 Gen 1 headers
2 x USB 2.0/1.1 headers
1 x Thunderbolt™ add-in card connector
1 x Trusted Platform Module (TPM) header (2x6 pin, for the GC-TPM2.0_S module only)
1 x temperature sensor header
1 x Clear CMOS jumper
Back Panel Connectors:
1 x PS/2 keyboard/mouse port
2 x USB 3.1 Gen 2 Type-A ports (red)
6 x USB 3.1 Gen 1 ports
1 x RJ-45 port
6 x audio jacks (Center/Subwoofer Speaker Out, Rear Speaker Out, Side Speaker Out, Line In, Line Out, Mic In)
I/O Controller:
iTE® I/O Controller Chip
BIOS:
2 x 128 Mbit flash
Use of licensed AMI UEFI BIOS
Support for DualBIOS™
PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0
Form Factor:
ATX Form Factor; 30.5cm x 24.4cm
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Технически характеристики
Процесор сокет: | LGA 2066 |
---|---|
Чипсет: | X299 |
Поддържана памет: | DDR4 |
Брой слотове за RAM памет: | 8 |
Storage интерфейси: | SATA 6Gbit/s, M.2 |
RAID: | Да |
Безжични мрежи: | Не |
Bluetooth: | Не |
Видео слот: | PCI-E |
Multi-Graphics технология: | CrossFire & SLI |
Видео изход: | Няма |
Форм фактор: | ATX |
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