# of Cores: 6
# of Threads: 12
Clock Speed: 2.4 GHz
Max Turbo Frequency: 3.2 GHz
Intel® Smart Cache: 15 MB
Intel® QPI Speed: 8 GT/s
# of QPI Links: 2
Instruction Set: 64-bit
Instruction Set Extensions: AVX 2.0
Embedded Options Available: Yes
Lithography: 22 nm
Scalability: 2S
Max TDP: 85 W
VID Voltage Range: 0.65V–1.30V
Memory Specifications
Max Memory Size (dependent on memory type): 768 GB
Memory Types: DDR4-1600/1866
# of Memory Channels: 4
Max Memory Bandwidth: 59 GB/s
Physical Address Extensions: 46-bit
ECC Memory Supported ‡: Yes
Expansion Options
PCI Express Revision: 3.0
PCI Express Configurations: x4, x8, x16
Max # of PCI Express Lanes: 40
Package Specifications
Max CPU Configuration 2
TCASE 72.6°C
Package Size 52.5mm x 45mm
Sockets Supported FCLGA2011-3
Low Halogen Options Available See MDDS
Advanced Technologies
Intel® Turbo Boost Technology ‡ 2.0
Intel® vPro Technology ‡ Yes
Intel® Hyper-Threading Technology ‡ Yes
Intel® Virtualization Technology (VT-x) ‡ Yes
Intel® Virtualization Technology for Directed I/O (VT-d) ‡ Yes
Intel® VT-x with Extended Page Tables (EPT) ‡ Yes
Intel® TSX-NI No
Intel® 64 ‡ Yes
Idle States Yes
Enhanced Intel SpeedStep® Technology Yes
Intel® Demand Based Switching Yes
Thermal Monitoring Technologies Yes
Intel® Flex Memory Access No
Intel® Identity Protection Technology ‡ No
Intel® Data Protection Technology
AES New Instructions Yes
Secure Key Yes
Intel® Platform Protection Technology
OS Guard Yes
Trusted Execution Technology Yes
Execute Disable Bit ‡ Yes
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# of Threads: 12
Clock Speed: 2.4 GHz
Max Turbo Frequency: 3.2 GHz
Intel® Smart Cache: 15 MB
Intel® QPI Speed: 8 GT/s
# of QPI Links: 2
Instruction Set: 64-bit
Instruction Set Extensions: AVX 2.0
Embedded Options Available: Yes
Lithography: 22 nm
Scalability: 2S
Max TDP: 85 W
VID Voltage Range: 0.65V–1.30V
Memory Specifications
Max Memory Size (dependent on memory type): 768 GB
Memory Types: DDR4-1600/1866
# of Memory Channels: 4
Max Memory Bandwidth: 59 GB/s
Physical Address Extensions: 46-bit
ECC Memory Supported ‡: Yes
Expansion Options
PCI Express Revision: 3.0
PCI Express Configurations: x4, x8, x16
Max # of PCI Express Lanes: 40
Package Specifications
Max CPU Configuration 2
TCASE 72.6°C
Package Size 52.5mm x 45mm
Sockets Supported FCLGA2011-3
Low Halogen Options Available See MDDS
Advanced Technologies
Intel® Turbo Boost Technology ‡ 2.0
Intel® vPro Technology ‡ Yes
Intel® Hyper-Threading Technology ‡ Yes
Intel® Virtualization Technology (VT-x) ‡ Yes
Intel® Virtualization Technology for Directed I/O (VT-d) ‡ Yes
Intel® VT-x with Extended Page Tables (EPT) ‡ Yes
Intel® TSX-NI No
Intel® 64 ‡ Yes
Idle States Yes
Enhanced Intel SpeedStep® Technology Yes
Intel® Demand Based Switching Yes
Thermal Monitoring Technologies Yes
Intel® Flex Memory Access No
Intel® Identity Protection Technology ‡ No
Intel® Data Protection Technology
AES New Instructions Yes
Secure Key Yes
Intel® Platform Protection Technology
OS Guard Yes
Trusted Execution Technology Yes
Execute Disable Bit ‡ Yes
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Технически характеристики
Процесор сокет: | LGA2011 |
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