Intel Xeon Processor E3-1270v3 (8M Cache, 3.50 GHz)
# of Cores - 4
# of Threads - 8
Clock Speed - 3.5 GHz
Max Turbo Frequency - 3.9 GHz
Intel® Smart Cache - 8 MB
DMI - 5 GT/s
# of QPI Links - 0
Instruction Set - 64-bit
Instruction Set Extensions - SSE 4.1/4.2, AVX 2.0
Embedded Options Available - No
Lithography - 22 nm
Scalability - 1S Only
Max TDP - 80 W
Thermal Solution Specification - PCG 2013D
Memory Specifications
Max Memory Size (dependent on memory type) - 32 GB
Memory Types - DDR3-1333/1600
# of Memory Channels - 2
Max Memory Bandwidth - 25.6 GB/s
ECC Memory Supported - Yes
Graphics Specifications
Processor Graphics - None
Expansion Options
PCI Express Revision - 3.0
PCI Express Configurations - 1x16, 2x8, 1x8/2x4
Max # of PCI Express Lanes - 16
Package Specifications
Max CPU Configuration - 1
Package Size - 37.5mm x 37.5mm
Graphics and IMC Lithography - 22nm
Sockets Supported - FCLGA1150
Low Halogen Options Available - See MDDS
Advanced Technologies
Intel® Turbo Boost Technology - 2.0
Intel® vPro Technology - Yes
Intel® Hyper-Threading Technology - Yes
Intel® Virtualization Technology (VT-x) - Yes
Intel® Virtualization Technology for Directed I/O (VT-d) - Yes
Intel® VT-x with Extended Page Tables (EPT) - Yes
Intel® TSX-NI - Yes
Intel® 64 - Yes
Idle States - Yes
Enhanced Intel SpeedStep® Technology - Yes
Thermal Monitoring Technologies - Yes
Intel® Fast Memory Access - Yes
Intel® Flex Memory Access - Yes
Intel® Identity Protection Technology ‡ - Yes
Intel® Stable Image Platform Program (SIPP) - Yes
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# of Cores - 4
# of Threads - 8
Clock Speed - 3.5 GHz
Max Turbo Frequency - 3.9 GHz
Intel® Smart Cache - 8 MB
DMI - 5 GT/s
# of QPI Links - 0
Instruction Set - 64-bit
Instruction Set Extensions - SSE 4.1/4.2, AVX 2.0
Embedded Options Available - No
Lithography - 22 nm
Scalability - 1S Only
Max TDP - 80 W
Thermal Solution Specification - PCG 2013D
Memory Specifications
Max Memory Size (dependent on memory type) - 32 GB
Memory Types - DDR3-1333/1600
# of Memory Channels - 2
Max Memory Bandwidth - 25.6 GB/s
ECC Memory Supported - Yes
Graphics Specifications
Processor Graphics - None
Expansion Options
PCI Express Revision - 3.0
PCI Express Configurations - 1x16, 2x8, 1x8/2x4
Max # of PCI Express Lanes - 16
Package Specifications
Max CPU Configuration - 1
Package Size - 37.5mm x 37.5mm
Graphics and IMC Lithography - 22nm
Sockets Supported - FCLGA1150
Low Halogen Options Available - See MDDS
Advanced Technologies
Intel® Turbo Boost Technology - 2.0
Intel® vPro Technology - Yes
Intel® Hyper-Threading Technology - Yes
Intel® Virtualization Technology (VT-x) - Yes
Intel® Virtualization Technology for Directed I/O (VT-d) - Yes
Intel® VT-x with Extended Page Tables (EPT) - Yes
Intel® TSX-NI - Yes
Intel® 64 - Yes
Idle States - Yes
Enhanced Intel SpeedStep® Technology - Yes
Thermal Monitoring Technologies - Yes
Intel® Fast Memory Access - Yes
Intel® Flex Memory Access - Yes
Intel® Identity Protection Technology ‡ - Yes
Intel® Stable Image Platform Program (SIPP) - Yes
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Технически характеристики
Процесор сокет: | LGA1150 |
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