Intel Xeon Processor E3-1270 v2 (8M Cache, 3.50 GHz)
# of Cores - 4
# of Threads - 8
Clock Speed - 3.5 GHz
Max Turbo Frequency - 3.9 GHz
Intel® Smart Cache - 8 MB
DMI - 5 GT/s
Instruction Set - 64-bit
Instruction Set Extensions - AVX, SSE4.1,SSE4.2
Embedded Options Available - No
Lithography - 22 nm
Max TDP - 69 W
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Memory Specifications
Max Memory Size (dependent on memory type) - 32 GB
Memory Types - DDR3-1333/1600
# of Memory Channels - 2
Max Memory Bandwidth - 25.6 GB/s
ECC Memory Supported - Yes
Graphics Specifications
Intel® InTru™ 3D Technology - No
Intel® Insider™ - No
Intel® Wireless Display - No
Intel® Flexible Display Interface (Intel® FDI)- No
Intel® Clear Video HD Technology - No
Intel® Clear Video Technology for MID - No
# of Displays Supported - 0
Expansion Options
PCI Express Revision - 3.0
PCI Express Configurations - 1x16 & 1x4, 2x8 & 1x4 or 1x8 & 3x4
Package Specifications
Max CPU Configuration - 1
Package Size - 37.5mm x 37.5mm
Sockets Supported - FCLGA1155
Low Halogen Options Available - See MDDS
Advanced Technologies
Intel® Turbo Boost Technology - 2.0
Intel® vPro Technology - Yes
Intel® Hyper-Threading Technology - Yes
Intel® Virtualization Technology (VT-x) - Yes
Intel® Virtualization Technology for Directed I/O (VT-d) - Yes
Intel® VT-x with Extended Page Tables (EPT) - Yes
Intel® TSX-NI - No
Intel® 64 - Yes
Idle States - Yes
Enhanced Intel SpeedStep® Technology - Yes
Intel® Demand Based Switching - Yes
Thermal Monitoring Technologies - Yes
Intel® Fast Memory Access - Yes
Intel® Flex Memory Access - Yes
Intel® Identity Protection Technology - Yes
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# of Cores - 4
# of Threads - 8
Clock Speed - 3.5 GHz
Max Turbo Frequency - 3.9 GHz
Intel® Smart Cache - 8 MB
DMI - 5 GT/s
Instruction Set - 64-bit
Instruction Set Extensions - AVX, SSE4.1,SSE4.2
Embedded Options Available - No
Lithography - 22 nm
Max TDP - 69 W
-
Memory Specifications
Max Memory Size (dependent on memory type) - 32 GB
Memory Types - DDR3-1333/1600
# of Memory Channels - 2
Max Memory Bandwidth - 25.6 GB/s
ECC Memory Supported - Yes
Graphics Specifications
Intel® InTru™ 3D Technology - No
Intel® Insider™ - No
Intel® Wireless Display - No
Intel® Flexible Display Interface (Intel® FDI)- No
Intel® Clear Video HD Technology - No
Intel® Clear Video Technology for MID - No
# of Displays Supported - 0
Expansion Options
PCI Express Revision - 3.0
PCI Express Configurations - 1x16 & 1x4, 2x8 & 1x4 or 1x8 & 3x4
Package Specifications
Max CPU Configuration - 1
Package Size - 37.5mm x 37.5mm
Sockets Supported - FCLGA1155
Low Halogen Options Available - See MDDS
Advanced Technologies
Intel® Turbo Boost Technology - 2.0
Intel® vPro Technology - Yes
Intel® Hyper-Threading Technology - Yes
Intel® Virtualization Technology (VT-x) - Yes
Intel® Virtualization Technology for Directed I/O (VT-d) - Yes
Intel® VT-x with Extended Page Tables (EPT) - Yes
Intel® TSX-NI - No
Intel® 64 - Yes
Idle States - Yes
Enhanced Intel SpeedStep® Technology - Yes
Intel® Demand Based Switching - Yes
Thermal Monitoring Technologies - Yes
Intel® Fast Memory Access - Yes
Intel® Flex Memory Access - Yes
Intel® Identity Protection Technology - Yes
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Виж всички Сървъри Процесори в категорията
Технически характеристики
Процесор сокет: | LGA1155 |
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