Case Size : Mid-Tower
Material : SECC Steel
External Drive Bay : 5.25" x 1
Internal Drive Bay
5.25" x 2
3.5” / 2.5” x 4 (Supports up to SATA HDD EZ-Swap Module x 4)
2.5” x 2
M/B Form Factor : ATX, Micro-ATX
Power Supply : ATX 12V, PSII Size and EPS up to 220mm (170mm with Bottom Fan)
I/O Port :
USB 3.0 x 1
USB 2.0 x 2
HD Audio
I/O Expansion Slots : PCI-E Slot x 7
Supports High-end Graphic Card up to 408mm
Thermal Solution :
Front - 120mm Fan x 2
Rear - 120mm LED Fan x 1
Bottom - 120mm Fan x 1
Maximum CPU Heatsink up to 160mm (From CPU Die Surface to Side Panel)
Water-Cooling Hole Ready
Chassis Dimension (HxWxD) : 432 x 210 x 477 mm
(17” x 8.3” x 18.8”)
Package Dimension (HxWxD) : 480 x 256 x 549 mm
(18.9” x 10.1” x 21.7”)
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Material : SECC Steel
External Drive Bay : 5.25" x 1
Internal Drive Bay
5.25" x 2
3.5” / 2.5” x 4 (Supports up to SATA HDD EZ-Swap Module x 4)
2.5” x 2
M/B Form Factor : ATX, Micro-ATX
Power Supply : ATX 12V, PSII Size and EPS up to 220mm (170mm with Bottom Fan)
I/O Port :
USB 3.0 x 1
USB 2.0 x 2
HD Audio
I/O Expansion Slots : PCI-E Slot x 7
Supports High-end Graphic Card up to 408mm
Thermal Solution :
Front - 120mm Fan x 2
Rear - 120mm LED Fan x 1
Bottom - 120mm Fan x 1
Maximum CPU Heatsink up to 160mm (From CPU Die Surface to Side Panel)
Water-Cooling Hole Ready
Chassis Dimension (HxWxD) : 432 x 210 x 477 mm
(17” x 8.3” x 18.8”)
Package Dimension (HxWxD) : 480 x 256 x 549 mm
(18.9” x 10.1” x 21.7”)
JAR Computers може да предложи ремонт/смяна/монтаж в наш сервиз или при партньор.
Виж още Компютърни кутии Win In
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