TW3X2G1600C9DHX G
The TW3X2G1600C9DHX G is a 2048MByte matched pair of DDR3 SDRAM DIMMs built using Corsair’s latest high performance heat sink with Dual-Path Heat Xchange (DHX) technology. This part delivers outstanding performance in the latest generation of dual-channel DDR3-based motherboards. It has been tested extensively in popular DDR3 motherboards to ensure compatibility
and performance at its rated speed. This memory has been verified to operate at 1600MHz at the low latencies of 9-9-9-24.
Dual-Path Heat Xchange Diagram
• Optimized fins to maximize ambient airflow through the module array
• Extruded aluminum heat sinks to maximize convective heat dissipation
• Dedicated PCB heat sink
TEST SPECS
Each module pair is tested together at 1600MHz
Tested and packaged in pairs
Packaged together immediately following system test
Tested together at 1600MHz, Vdimm = 1.80V, at latency settings of 9-9-9-24
SPD programmed at: JEDEC standard 7-7-7-20 values at
1066MHz
FEATURES
2048 Megabytes of DDR3 memory
Two matched CM3X1G1600C9DHX G modules
Using DHX technology providing maximum cooling
100% tested at 1600MHz in high performance DDR3 motherboards
Lifetime warranty
Виж още Настолни компютри Памети Corsair
Виж всички Настолни компютри Памети в категорията
The TW3X2G1600C9DHX G is a 2048MByte matched pair of DDR3 SDRAM DIMMs built using Corsair’s latest high performance heat sink with Dual-Path Heat Xchange (DHX) technology. This part delivers outstanding performance in the latest generation of dual-channel DDR3-based motherboards. It has been tested extensively in popular DDR3 motherboards to ensure compatibility
and performance at its rated speed. This memory has been verified to operate at 1600MHz at the low latencies of 9-9-9-24.
Dual-Path Heat Xchange Diagram
• Optimized fins to maximize ambient airflow through the module array
• Extruded aluminum heat sinks to maximize convective heat dissipation
• Dedicated PCB heat sink
TEST SPECS
Each module pair is tested together at 1600MHz
Tested and packaged in pairs
Packaged together immediately following system test
Tested together at 1600MHz, Vdimm = 1.80V, at latency settings of 9-9-9-24
SPD programmed at: JEDEC standard 7-7-7-20 values at
1066MHz
FEATURES
2048 Megabytes of DDR3 memory
Two matched CM3X1G1600C9DHX G modules
Using DHX technology providing maximum cooling
100% tested at 1600MHz in high performance DDR3 motherboards
Lifetime warranty
Виж още Настолни компютри Памети Corsair
Виж всички Настолни компютри Памети в категорията
Технически характеристики
| Капацитет: | 2 (2x1) GB |
|---|---|
| Скорост: | 1600 MT/s |
| Тип: | DDR3 |
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