Intel® Core™ i3-4160 Processor
(3M Cache, 3.60 GHz)
# of Cores - 2
# of Threads - 4
Clock Speed - 3.6 GHz
Intel® Smart Cache - 3 MB
DMI2 - 5 GT/s
# of QPI Links - 0
Instruction Set - 64-bit
Instruction Set Extensions - SSE4.1/4.2 AVX2.0
Embedded Options Available - No
Lithography - 22 nm
Scalability - 1S Only
Max TDP - 54 W
Thermal Solution Specification - PCG 2013C
Conflict Free - Yes
Memory Specifications
Max Memory Size (dependent on memory type) - 32 GB
Memory Types - DDR3-1333/1600
# of Memory Channels - 2
Max Memory Bandwidth - 25.6 GB/s
ECC Memory Supported - Yes
Graphics Specifications
Processor Graphics - Intel® HD Graphics 4400
Graphics Base Frequency - 350 MHz
Graphics Max Dynamic Frequency - 1.15 GHz
Graphics Video Max Memory - 1.7 GB
Intel® Quick Sync Video - Yes
Intel® InTru™ 3D Technology - Yes
Intel® Wireless Display - Yes
Intel® Clear Video HD Technology - Yes
# of Displays Supported - 3
Expansion Options
PCI Express Revision - 3.0
PCI Express Configurations - Up to 1x16, 2x8, 1x8/2x4
Max # of PCI Express Lanes - 16
Package Specifications
Max CPU Configuration - 1
TCASE - 66.4°C
Graphics and IMC Lithography - 22nm
Sockets Supported - FCLGA1150
Low Halogen Options Available - See MDDS
Advanced Technologies
Intel® Turbo Boost Technology - No
Intel® vPro Technology - No
Intel® Hyper-Threading Technology - Yes
Intel® Virtualization Technology (VT-x) - Yes
Intel® Virtualization Technology for Directed I/O (VT-d) - No
Intel® VT-x with Extended Page Tables (EPT) - Yes
Intel® TSX-NI - No
Intel® 64 - Yes
Idle States - Yes
Enhanced Intel SpeedStep® Technology - Yes
Thermal Monitoring Technologies - Yes
Intel® Stable Image Platform Program (SIPP) - No
Intel® Data Protection Technology
AES New Instructions - Yes
Secure Key - Yes
Intel® Platform Protection Technology
Trusted Execution Technology - No
Execute Disable Bit - Yes
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(3M Cache, 3.60 GHz)
# of Cores - 2
# of Threads - 4
Clock Speed - 3.6 GHz
Intel® Smart Cache - 3 MB
DMI2 - 5 GT/s
# of QPI Links - 0
Instruction Set - 64-bit
Instruction Set Extensions - SSE4.1/4.2 AVX2.0
Embedded Options Available - No
Lithography - 22 nm
Scalability - 1S Only
Max TDP - 54 W
Thermal Solution Specification - PCG 2013C
Conflict Free - Yes
Memory Specifications
Max Memory Size (dependent on memory type) - 32 GB
Memory Types - DDR3-1333/1600
# of Memory Channels - 2
Max Memory Bandwidth - 25.6 GB/s
ECC Memory Supported - Yes
Graphics Specifications
Processor Graphics - Intel® HD Graphics 4400
Graphics Base Frequency - 350 MHz
Graphics Max Dynamic Frequency - 1.15 GHz
Graphics Video Max Memory - 1.7 GB
Intel® Quick Sync Video - Yes
Intel® InTru™ 3D Technology - Yes
Intel® Wireless Display - Yes
Intel® Clear Video HD Technology - Yes
# of Displays Supported - 3
Expansion Options
PCI Express Revision - 3.0
PCI Express Configurations - Up to 1x16, 2x8, 1x8/2x4
Max # of PCI Express Lanes - 16
Package Specifications
Max CPU Configuration - 1
TCASE - 66.4°C
Graphics and IMC Lithography - 22nm
Sockets Supported - FCLGA1150
Low Halogen Options Available - See MDDS
Advanced Technologies
Intel® Turbo Boost Technology - No
Intel® vPro Technology - No
Intel® Hyper-Threading Technology - Yes
Intel® Virtualization Technology (VT-x) - Yes
Intel® Virtualization Technology for Directed I/O (VT-d) - No
Intel® VT-x with Extended Page Tables (EPT) - Yes
Intel® TSX-NI - No
Intel® 64 - Yes
Idle States - Yes
Enhanced Intel SpeedStep® Technology - Yes
Thermal Monitoring Technologies - Yes
Intel® Stable Image Platform Program (SIPP) - No
Intel® Data Protection Technology
AES New Instructions - Yes
Secure Key - Yes
Intel® Platform Protection Technology
Trusted Execution Technology - No
Execute Disable Bit - Yes
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Виж още Настолни компютри Процесори Intel
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Технически характеристики
Процесор сокет: | LGA1150 |
---|---|
Брой ядра: | 2 |
Архитектура: | 64 |
Термична мощност (TDP): | 54 W |
Честота процесор: | 3600 MHz |
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